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Laser Material Processing

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Capabilities:

Dimension Accuracy ± 1 µm
Position Accuracy ± 1 µm (coordinate)
Aspect Ratio 5
Roughness Ra<0.05um
Materials Polymer, PMMA, Polycarbonate, PET and thick photoresist


Laser material processing utilizes the wide range of laser material processing capabilities and flexibility and accuracy of pattern-definition by photo masks to achieve high throughput and high precision. 2D and 3D micro structures are possible. MicroBase utilizes excimer, Nd:YAG and various types of lasers to meet customers' special process requirements. Applications include inkjet nozzle plates, micro fluidics devices, micro parts and laser patterning for ITOs or conductive films.

 

Laser processing such as ablation, cutting, drilling, grooving, and 2D/3D structuring, metals and alloys can be performed with very high accuracy and little or none thermal effects (no heat affected zone, HAZ). It is suitable for either fast prototyping or serial mass production.

 

Features:

•  Clean Surface with Superior Roughness

•  Wide Ranges of Laser Capabilities for Many Materials and Applications

•  Clean Room Environment

•  Short Turn-Around for Fast Prototyping

•  High Volume Manufacturing Capability

 

Applications:

•  Inkjet Printer Head

•  Micro Fluidics

•  LCD ITO Patterning

•  Flexible Electronics

 
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